Resin Bonded Grinding Discs

The Grinding Wheels for LED substrate are mainly used for back thinning of sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer.
Workpiece processed: sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer.
Material of workpiece: synthetic sapphire, single crystal silicon, gallium arsenide and GaN materials.
Grinders: SHUWA SGM-6301, NTS Nanosurface-180G, NTS Nanosurface 250/NC-VDM

6A2T grinding wheels

Features:

1.Be used with Japanese, German, American, Korea and Chinese grinders
2.Superior grinding performance
3.High cost performance

Specfication:

Contact us if you need more details on Back Grinding Wheels for GaN Wafer. We are ready to answer your questions on packaging, logistics, certification or any other aspects about Back Grinding Wheels for Sapphire、Back Grinding Wheels for GaAs. If these products fail to match your need, please contact us and we would like to provide relevant information.

Product Categories : Abrasion Wheels > Back Grinding Diamond Wheels